MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202621048527 A) filed by Electronics Devices Worldwide Private Limited on April 16, 2026, for A System With A Novel Coil Head And A Novel Tank Circuit For High–speed Induction Sealing Of Containers.
Inventors include Arun Kumar Paul; Sandeep Chinoy; Bikram Nahak; and Dhananjay Giri.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: The present invention proposes a set of double layer or multilayer coil segments to boost the power transfer to the foil when the coupling coefficient between the coil and the foil is not large. In situations where the foil is placed near a coil, the magnetic field from the coil induces eddy currents in the conductive foil. A higher coupling coefficient means more flux links the foil, leading to higher eddy currents and higher power density on foil surface. The value of Coupling coefficient depends heavily on the physical separation between the coil and foil, their alignment, and the shape of the components. Closer proximity of coil and foil increase the coupling coefficient. The coupling coefficient dictates the effectiveness of power transfer. Figure 12 –Abstract Figure
Disclaimer: Curated by HT Syndication.
