MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202621023209 A) filed by Attron Automotive Private Limited on February 26, 2026, for A Rotor Assembly For Eesm With Aluminium Cooling Cover And Heat Sink.
Inventors include Shubham Shadanan Pode; Mosam Pradip Ugemuge; Ojasvi Arora; and Srushti Sawant.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: A ROTOR ASSEMBLY FOR EESM WITH ALUMINIUM COOLING COVER AND HEAT SINK The present disclosure relates to an assembly (100) for EESM is disclosed for facilitating thermal management of a rotor structure. The assembly (100) comprises a rotor (102) mounted on a shaft, the rotor including a laminated core having excitation windings disposed therein. A thermally conductive potting layer (106) is disposed radially outward of the rotor (102) and occupies an annular space surrounding the rotor (102) to establish thermal coupling with an outer surface thereof. An aluminum cover (104) is disposed over and surrounds the potting layer (110), the aluminum cover (104) being configured to receive heat transmitted from the rotor (102) and distribute the heat along its circumferential body. A heat sink (108) mounted on an outer surface of the aluminum cover (104) comprises outward-facing radial fins for facilitating convective heat dissipation to a surrounding environment.
Disclaimer: Curated by HT Syndication.
