MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202511002960 A) filed by Lumax Industries Limited on January 13, 2025, for A Pcb Module Assembly For Better Heat Dissipation.
Inventors include Sharma; Sanjeev.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: A PCB MODULE ASSEMBLY FOR BETTER HEAT DISSIPATION ABSTRACT The PCB module assembly including stacked metalcore PCB for effective heat management in an electronic assembly includes a PCB that has a metal (aluminium) core/aluminium plate with mounting holes which forms the base wherein the other components are mounted such as finger heatsink ribs present at the end bend at an angle of 800-1000 to the metal plate, card edge connectors that connects one PCB to another PCB, LEDs , reflectors and thermally conductive paste/tape/grease. The stacked-up placement of PCB’s forms a sandwich like structure which itself works as heat sink because of approximately 1-7 millimetres of spacing between the two metal plates/metal cores. The present invention ensures temperature of the automobile components and especially the PCB module of headlamp/headlight stays/maintained at optimum temperature. Figure.1
Disclaimer: Curated by HT Syndication.
