MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202621096506 A) filed by Econovus Packaging Private Limited on August 10, 2026, for A Pallet-Less Packaging System For Transportation Of Automotive And Industrial Components.
Inventor includes Prasad, Ramesh.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: A pallet-less packaging system (100) for transportation of automotive and industrial components comprises a base structure (102) incorporating center of gravity (CG) runners (104) integrated directly into the bottom of the base structure (102) to enable forklift and material handling operations without an independent pallet. A removable sleeve structure (106) vertically mounts onto the base structure (102) to form a rigid enclosure defining an internal compartment (108). A top cap (110) fits over and encloses the upper open end of the removable sleeve structure (106). A multi-directional dunnage assembly (112) comprises a top dunnage (114) disposed on the top cap (110) and a side dunnage (116) disposed on the removable sleeve structure (106). Customized internal fitments (118) comprising engineered wooden fitments (120) and expanded polyethylene foam inserts (122) are arranged within the internal compartment (108) and contoured to securely locate and lock a component at designated contact points.
Disclaimer: Curated by HT Syndication.
