MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202521031603 A) filed by Avadhoot Umakant Rajurkar; and Girish Narayan Kotwal on March 31, 2025, for A Novel Extrusion System Attachment For Robot-Based Soil 3d Printing.
Inventors include Avadhoot Umakant Rajurkar; and Girish Narayan Kotwal.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: This patent describes a soil 3D printing design with an extrusion mechanism designed for mounting on industrial robotic arms. The design enables precise movement and positioning during the printing process. The setup comprises housing for encasing as well as supporting components of the extrusion mechanism. Further, it consists of a motorized pump mechanism to extrude soil mixture through nozzle. The system also includes fixture for installing setup on robotic arm. The invention incorporates a user-friendly dismantling capability, allowing efficient disassembly into individual components for transport, storage, and replacement purposes. The soil 3D printing system demonstrated in this design showcases its versatility and practicality. The versatile nature of this soil 3D printing system opens up possibilities for applications in architecture, construction, and environmental engineering, providing sustainable and cost-effective solutions for creating customized structures.
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