MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202621051728 A) filed by Ayush Shashindra Sonawane; Pravin Jalindar Songal; Pruthviraj Vitthal Sonawane; Aryan Rohit Patil; Prithviraj Balaraj Sonawane; and Dr. Umesh Chavan on April 23, 2026, for A Multilayer Phase Change Material-Based Thermal Management System With Directional Heat Flow And Zonal Control For Ai Chip Cooling.
Inventors include Ayush Shashindra Sonawane; Pravin Jalindar Songal; Pruthviraj Vitthal Sonawane; Aryan Rohit Patil; Prithviraj Balaraj Sonawane; and Dr. Umesh Chavan.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: This invention relates to a thermal management system for AI chips that utilizes a multi-layered PCM design with directional heat flow layers and zonal segmentation. The purpose of this system is to mitigate high heat flux density and hotspots created by AI chips.. Heat generated by the AI chip is transferred through a thermal interface layer and a heat spreader to a directional heat routing layer configured to guide heat toward selected regions of the PCM structure. The PCM is arranged in multiple layers having different melting temperatures and divided into multiple zones corresponding to hotspot regions. The system enables localized and sequential heat absorption, wherein specific zones and layers undergo phase change based on thermal load. This leads to increased thermal stability, lower peak temperature, and optimal use of PCM. The leftover heat can be released by the cooling mechanism. This design allows for regulated thermal control in space and time, appropriate for AI chip systems.
Disclaimer: Curated by HT Syndication.
