MUMBAI, India, July 30 -- Intellectual Property India has published a patent application (202621067477 A) filed by Indian Institute Of Technology Indore on May 29, 2026, for A Multi-Track Aluminium-Copper Foil Laminate And A Solid-State Ultrasonic Additive Manufacturing Method Thereof.
Inventors include Rahul Naidu; Neelesh Kumar Jain; and Dr. Ashish Rajak.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: ABSTRACT A MULTI-TRACK ALUMINIUM-COPPER FOIL LAMINATE AND A SOLID-STATE ULTRASONIC ADDITIVE MANUFACTURING METHOD THEREOF The invention relates to solid-state ultrasonic additive manufacturing and discloses a multi-track aluminium-copper foil laminate and a manufacturing system and method therefor. The laminate comprises an aluminium foil layer and a copper foil layer, each of about 200 micrometres thickness, defining a consolidated sheet body of about 400 micrometres with a bonding interface region and a refined diffusion-controlled interfacial layer. A multi-track bonded architecture of six substantially parallel bonded tracks, each about 5 mm wide and 70 mm long, is formed within a 100 mm × 100 mm sheet area with about 10 mm spacing. An ultrasonic additive manufacturing system having a build platform, clamping arrangement, sonotrode, ultrasonic transduction unit, normal force application system, traverse system, and process parameter control unit operates at about 20 kHz, 28 micrometres amplitude, 5000 N, and 38 mm/s to produce disrupted oxide films, intimate metal- to-metal contact, localized diffusion paths, and crack-free inter-track continuity without bulk melting. Dated this 28th day of May, 2026 (Suvarna Pandey) Regd. Patent Agent [IN/PA-1592] Of RNA, IP Attorneys Agent for the Applicant
Disclaimer: Curated by HT Syndication.
