MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202641092857 A) filed by Aditya University on July 30, 2026, for A Multi-Stage Circular Cutting Device For Circular And Arc Profiling And Method Thereof.
Inventors include Kaladi Govindaraju; and K Ravi Kumar Reddy.
The application for the patent was published on August 07, 2026, under issue no. 32/2026.
Abstract: The present disclosure proposes a multi-stage circular cutting device (100) configured to perform adjustable circular and arc profiling operations on wooden workpieces (10) by integrating symmetrical radius adjustment, workpiece (10) positioning, and controlled workpiece (10) guidance, thereby improving dimensional accuracy, enhancing operational efficiency, and minimizing alignment errors. The multi-stage circular cutting device (100) comprises a base (102), a supporting assembly (108), a screw shaft (112), a pair of carriers (118A, 118B), and an angular adjustment assembly (126). The multi-stage circular cutting device (100) is capable of independently adjusting a cutting radius and the workpiece (10) position to facilitate accurate circular and arc profiling operations. The multi-stage circular cutting device (100) enables continuous and symmetrical radius adjustment for producing circular profiles of varying dimensions with improved positional accuracy.
Disclaimer: Curated by HT Syndication.
