MUMBAI, India, July 24 -- Intellectual Property India has published a patent application (202611064322 A) filed by Noida Institute Of Engineering & Technology on May 21, 2026, for A Multi-Protocol Communication Interface For Embedded Platforms.
Inventors include Dr. Akanksha Singh; and Bhawna Khullar.
The application for the patent was published on July 17, 2026, under issue no. 29/2026.
Abstract: A multi-protocol communication interface for embedded platforms is disclosed. The interface includes protocol ports, protocol adaptation modules, a shared buffer fabric, an arbitration and scheduling unit, a timing alignment unit, a security and validation module, a diagnostic and recovery unit, and a platform interface controller. Protocol-specific messages are converted into internal transaction descriptors, buffered, scheduled, validated, and delivered to configured destinations. The interface supports configurable routing, timing coordination, shared memory use, fault isolation, and centralized policy enforcement for heterogeneous embedded communication channels.
Disclaimer: Curated by HT Syndication.
