MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202511016016 A) filed by Mahindra & Mahindra Limited on February 24, 2025, for A Modular Bumper System For A Vehicle And Method Thereof.
Inventors include Vikas Maingi; and Pardeep Kumar.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: The disclosure herein generally relate to bumper of vehicles and, more particularly, to a modular bumper system (100) configured to be mounted to the vehicle in a bumper stowed configuration to allow compact packaging of the vehicle. The modular bumper system (100) includes a bumper cross-member (102), a bumper guard member (104), a bumper mounting assembly (106), bumper connector arms (108A, 108B), a first towing bracket (110) and a pair of second towing brackets (112). Each bumper connector arm (108A, 108B) is removably or adjustably or movably connected to the bumper mounting assembly (106), allowing flexible positioning of the bumper system (100) relative to the vehicle in one of a bumper operative configuration or the bumper stowed configuration. The bumper system (100) facilitates compact installation, simplifies mounting and removal, and enables easy towing hook attachment for enhanced transport convenience. Additionally, the bumper system (100) is robust, user-friendly, and designed for efficient packaging. Fig. 11A
Disclaimer: Curated by HT Syndication.
