MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202617057076 A) filed by Micronit Holding B. V. on May 05, 2026, for A Method Of Manufacturing A Nozzle Assembly, Comprising Weakening A Wafer At At Least Two Focal Zones In The Depth Direction By Focusing A Laser Beam.
Inventors include Oonk, Johannes; Bosman, Mathijs Christian; Vermeer, Rolf; and Blom, Marko Theodoor.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: The invention relates to a method of manufacturing at least one nozzle assembly for atomising a fluid. The method comprises a) providing the at least one nozzle assembly pre-arranged in a wafer; and b) separating the at least one nozzle assembly from remaining wafer material. According to the invention, step b) comprises locally weakening the wafer between the at least one nozzle assembly and the remaining wafer material at at least two focal zones in the depth direction by the focusing of a laser beam. The invention also relates to a composite structure for forming such nozzle assemblies, the composite structure comprising at least two weakened zones in the depth direction. Finally, a nozzle assembly manufactured with the described method is claimed.
Disclaimer: Curated by HT Syndication.
