MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202611101877 A) filed by Deepak Kumar Mishra; and Sardar Vallabhbhai Patel University Of Agriculture & Technology on August 24, 2026, for A Method For Manufacturing An Agro-Composite Structural Panel For Grain Storage Structures.

Inventors include Deepak Kumar Mishra; Vineet Kumar Sharma; Nishant Singh; Sushant Kumar; and Deepak Singh.

The application for the patent was published on October 02, 2026, under issue no. 40/2026.

Abstract: The present disclosure relates to an agro-residue-based epoxy composite material, a structural panel including the composite material, and a method (100) for manufacturing the same for agricultural storage applications. The composite material includes lignocellulosic agricultural residues selected from paddy straw, sugarcane bagasse, mustard stalk, wood sawdust, or combinations thereof, incorporated in a thermosetting epoxy resin matrix together with an inorganic particulate filler and a curing agent. The agricultural residues are cleaned, dried and reduced to reinforcing particles, followed by mixing with inorganic particulate filler and the epoxy resin system to obtain a substantially homogeneous composite mixture. The composite mixture is moulded and cured to obtain a cured agro-composite structural panel, optionally incorporating a reinforcing polymeric mesh within the panel. The residue-to-epoxy proportion is selected to provide desired physical and mechanical characteristics of the composite. (FIG. 1 is the reference figure)

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