MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202441103301 A) filed by Mercedes-Benz Group AG on December 26, 2024, for A Mechanism For Dynamically Displacing A Sensor Unit Within A Sensor Assembly.
Inventor includes Sampath Shetty.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: A MECHANISM FOR DYNAMICALLY DISPLACING A SENSOR UNIT WITHIN A SENSOR ASSEMBLY Embodiments of the present disclosure relates to a mechanism for dynamically displacing a sensor unit within a sensor assembly. The mechanism include a set of lead screws (40). One end of the set of lead screws (40) being configured to engage a bottom surface of the Sensor unit (10) and secured to a vehicle roof (220). Further, the mechanism includes a set of worm wheels (41) rotatably engageable to each of the lead screws (40) and being adapted to displace along a length of the set of lead screws. Furthermore, the mechanism includes an actuator (60) operably coupled to the set of worm wheels and configured to rotate the set of worm wheels (41) to displace the set of worm wheels along the length of the lead screws and thereby dynamically displace the sensor unit between a first position and a second position. Fig. 1 is a representative figure.
Disclaimer: Curated by HT Syndication.
