MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202531028775 A) filed by Tata Steel Limited on March 26, 2025, for A High Strength Wire And A Method Of Producing The High Strength Wire.
Inventors include Debasis Poddar; Yellapu Bhaskara Rao; Navneet Kumar Pandit; and Sudip Santra.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: A HIGH STRENGTH WIRE AND A METHOD OF PRODUCING THE HIGH STRENGTH WIRE The present disclosure discloses a high strength wire. The high strength wire includes composition (in wt.%) of, carbon (C) in a range of 0.3 to 0.5, silicon (Si) in a range of 0.2 to 0.6, manganese (Mn) in a range of 0.01 to 0.5, nickel (Ni) in a range of 0.01 to 0.6, aluminum (Al) in a range of 0.03 to 0.5, copper (Cu) in a range of 0.05 to 0.25, and balance being iron (Fe) along with inevitable impurities. The high strength wire is defined with a microstructure of alternate fine martensite and one of finer ferrite or finer bainitic-ferrite, where the fine martensite is in a range of 10 to 12 % and one of the finer ferrite is in a range of 5 to 7 % and the finer bainitic-ferrite is in a range of 77 to 80 %. Figure 1 is a representative figure.
Disclaimer: Curated by HT Syndication.
