MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202641115101 A) filed by Dr. P. Periyannan; Mr. S. Naveen Kumar; Varalakshmi Majji; Dr. A. Theja; Dutta Lakshmi Pavani; Dr. N. Thangaraj; Dr. M. C. Rao; Dr. R. Swapna; and Dr. S. Surya on September 25, 2026, for A High Performance Nanocomposite Material For Electromagnetic Interference Shielding In Advanced Electronics Devices.
Inventors include Dr. P. Periyannan; Mr. S. Naveen Kumar; Varalakshmi Majji; Dr. A. Theja; Dutta Lakshmi Pavani; Dr. N. Thangaraj; Dr. M. C. Rao; Dr. R. Swapna; and Dr. S. Surya.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: ABSTRACT OF THE INVENTION: The present invention discloses a high-performance hybrid nanocomposite material designed for efficient electromagnetic interference (EMI) shielding in advanced electronics devices. The material consists of a polymer matrix (preferably polyvinylidene fluoride, epoxy, polyurethane or PDMS) filled with a ternary hybrid nanofiller system comprising reduced graphene oxide (rGO) sheets, multi-walled carbon nanotubes (MWCNTs) and magnetite (Fe3O4) nanoparticles. The total hybrid filler content is maintained between 3 and 10 weight percent, with an optimized rGO:MWCNT:Fe3O4 weight ratio typically in the range 2:1:1 to 3:2:1. The Fe3O4 nanoparticles (size 8–25 nm) are preferentially grown in-situ on the functionalized surfaces of the carbonaceous fillers, ensuring uniform dispersion and strong interfacial bonding. The synergistic architecture creates a three-dimensional conductive network at low percolation threshold while simultaneously introducing magnetic loss mechanisms. Consequently, the nanocomposite exhibits high total EMI shielding effectiveness (greater than 50 dB, typically 55–60 dB in the X-band) at a film thickness of only 0.5 mm, with the absorption contribution exceeding 70% of the total shielding effectiveness. This absorption- dominated behaviour minimizes secondary electromagnetic radiation. The material remains flexible (elongation at break 15%), lightweight (density ~1.3–1.4 g/cm³), thermally stable and processable by conventional solution casting or melt-compounding techniques. Compared with pure polymer, single-filler or binary carbon-filler composites prepared under identical conditions, the ternary hybrid demonstrates a substantial synergistic improvement in shielding performance of more than 20 dB at the same total filler loading. The invention therefore provides a practical, scalable and high-performance solution for EMI shielding of 5G/6G modules, flexible circuits, wearable electronics, radar-absorbing coatings and aerospace systems where low weight, low thickness, mechanical compliance and high absorption efficiency are simultaneously required. The combination of dielectric and magnetic loss mechanisms within a single low-loading hybrid system constitutes the core novelty of the disclosed material.
Disclaimer: Curated by HT Syndication.
