MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202541022328 A) filed by Stellantis Auto Sas; and Fca Us LLC on March 12, 2025, for A Heat Sink Assembly With Improved Fin Arrangements For Effective Heat Dissipation.
Inventors include Shivaprasada Kv; Ravinder Singh; Manish Kumar; and Naresh Dalal.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: A heat sink assembly (100) for dissipating of heat from heat generating areas of a circuit board (105). The heat sink assembly (100) includes a top cover (101); a bottom cover (103) is fixed with the top cover (101), and a plurality of fins (104) configured to dissipate the heat from the heat generating areas of the circuit board (105). Further, the plurality of fins (104) are positioned in the top cover (101) and the bottom cover (103) in a particular pattern to maximize surface area available for heat dissipation and a rate of heat transfer from the circuit board (105). Further, the particular pattern is determined based on the heat generating area of the circuit board (105). Further, when the plurality of fins (104) is positioned at the particular pattern, the plurality of fins (104) directs air towards the heat generating area of the circuit board (105). [Figure. 2]
Disclaimer: Curated by HT Syndication.
