MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202541111406 A) filed by B. S. Abdur Rahman Crescent Institute Of Science And Technology on November 14, 2025, for A Dissolving Microneedle Array For Sustained Telmisartan Release.
Inventors include Dr. U. Ubaidulla; S. M. R. Fahima; M. Nadeemudeen; M. Nayeem Siddiq; and M. Vinodhini.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: The present subject matter is a dissolving microneedle patch designed for delivering Telmisartan. The dissolving needle patch comprises polyvinylpyrrolidone (PVP), hydroxypropyl methylcellulose (HPMC), ethyl cellulose, Telmisartan and dibutyl phthalate. A method of preparing the microneedle patch is disclosed. The formulation improves bioavailability by bypassing first-pass metabolism and provides patient-friendly administration.
Disclaimer: Curated by HT Syndication.
