MUMBAI, India, Aug. 24 -- Intellectual Property India has published a patent application (202641097661 A) filed by Srm Institute Of Science And Technology on August 12, 2026, for A Dissipative Underlay For Electronic Systems And A Process For Its Preparation.
Inventors include Geetha Sethuraj; and Poyyamozhi Mukilan.
The application for the patent was published on August 21, 2026, under issue no. 34/2026.
Abstract: ABSTRACT A DISSIPATIVE UNDERLAY FOR ELECTRONIC SYSTEMS AND A PROCESS FOR ITS PREPARATION The present disclosure relates to a dissipative underlay (100) for electronic systems and a process for its preparation. The dissipative underlay (100) effectively absorbs and dissipates heat for electronic systems and provides a durable and ergonomic design. The underlay provides a smooth, aesthetic finish, prevents thermal stress, and enhances the longevity of electronic systems. The dissipative underlay (100) consumes zero electricity. The process for preparing a dissipative underlay (100) is simple and environmentally friendly.
Disclaimer: Curated by HT Syndication.
