MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202641081746 A) filed by Rangsons Aerospace Pvt Ltd on July 02, 2026, for A Dimpling Tool Assembly For A Tube.
Inventor includes Sivaram Subramanian.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: “A DIMPLING TOOL ASSEMBLY FOR A TUBE” ABSTRACT The present disclosure discloses a dimpling tool assembly (100) for a tube (10). The assembly 5 includes a male die set (12) having two separable halves (12a, 12b) with a tapered outer surface (12c), and at least one port (16) configured to receive the tube (10). The two separable halves (12a, 12b) define a tube-receiving cavity (15) to accommodate the tube (10). A plurality of pins (13) are disposed in holes (14) formed in the male die set (12), with each pin (13) slidably movable within a respective hole (14) towards the tube-receiving cavity (15). A female die (11) has a tapered inner 10 cavity configured to receive the male die set (12). Insertion of the male die set (12) into the female die (11) causes the tapered inner cavity to engage and displace the plurality of pins (13) inwardly to form dimples on the tube (10). Figure 1 is a representative figure.
Disclaimer: Curated by HT Syndication.
