MUMBAI, India, Sept. 14 -- Intellectual Property India has published a patent application (202617069191 A) filed by Kandou Labs Sa on June 02, 2026, for A Die-To-Die Interface Coupled Between A Virtual Phy And Virtual Mac.
Inventors include Korger, Peter; Koch, Alexander; and Perrin, Victor.
The application for the patent was published on September 11, 2026, under issue no. 37/2026.
Abstract: A virtualised PHY (V-PHY) Interface for the PCI Express protocol is provided to enable a first PIPE-compliant component located on a first circuit die to communicate with a second PIPE-compliant component located on a second circuit die, where the first and second circuit dies are communicatively coupled to one another via a die- to-die (D2D) interface. The V-PHY interface can enable this communication transparently so that neither the first component nor second component needs to have any knowledge of the D2D interface or indeed that they are communicating across dies.
Disclaimer: Curated by HT Syndication.
