MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202641067934 A) filed by Kirta Ram Suthar on May 30, 2026, for A Demountable Partition Assembly With Acoustic Sealing.
Inventor includes Kirta Ram Suthar.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: The present invention relates to a modular acoustic demountable partition assembly (100) comprising a frame section (102), at least one rigid board layer (104), a resilient sealing element (106), an acoustic infill (108), and at least one fastening element (112). The frame section (102) supports and aligns the rigid board layer (104), while the acoustic infill (108) is retained within an internal cavity of the assembly (100) to attenuate airborne sound transmission. The resilient sealing element (106) is disposed at an interface of the assembly (100) to reduce acoustic leakage and accommodate dimensional tolerance. The fastening element (112) removably secures the frame section (102) to a support interface, thereby enabling dry installation, demounting, relocation, reconfiguration, and a mass-loaded acoustic barrier layer (110) is arranged with the rigid board layer (104) to enhance acoustic insulation.
Disclaimer: Curated by HT Syndication.
