MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202621096360 A) filed by Dr. D. Y. Patil Institute Of Technology, Pimpri, Pune- on August 10, 2026, for A Comparative Thermal Management System Employing Optimized Heat Sink Configurations For Efficient Heat Dissipation.
Inventors include Prof. Jeetendra Dhamone; Dr. Rakesh Raushan; Soham Shirvandkar; Prathamesh Shinde; and Sarthak Waghmare.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: The project titled “Comparative Thermal Analysis of Heat Sink Geometries for Enhanced Heat Dissipation” focuses on improving the cooling performance of heat sinks used in electronic and mechanical systems. Heat sinks play a vital role in maintaining safe operating temperatures of electronic components by dissipating excess heat generated during operation. The efficiency of a heat sink mainly depends on its geometry, material, and airflow conditions. In this project, different heat sink geometries such as rectangular fin, pin fin, and circular fin designs are analyzed and compared based on their thermal performance. The study aims to identify the geometry that provides maximum heat dissipation and better temperature distribution. Thermal analysis is carried out using simulation tools and theoretical calculations to evaluate parameters such as temperature variation, heat transfer rate, and thermal resistance. The results obtained from the comparative analysis help in understanding the effect of fin geometry on cooling efficiency. The project contributes to the development of compact, efficient, and cost-effective thermal management systems for applications in electronics, automotive systems, and industrial equipment. The optimized heat sink design can improve system reliability, performance, and lifespan by preventing overheating problems.
Disclaimer: Curated by HT Syndication.
