MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202611045089 A) filed by Indian Institute Of Technology Banaras Hindu University, Varanasi on April 08, 2026, for A Bioengineered Photocrosslinked Hydrogel Patch For Hemostasis And Enhanced Wound Healing And Methods Thereof.
Inventors include Mukherjee, Sudip; and Banerjee, Durba.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: The present invention relates to a bioengineered wound treatment device comprising a three-dimensional photocrosslinked hydrogel patch formed from a polymeric matrix of sodium alginate and gum tragacanth, and a secondary network comprising polyethylene glycol diacrylate (PEGDA). The patch comprises an interconnected porous architecture including lumen or lumen-like cavities and encapsulated viable mammalian cells configured to secrete therapeutic biomolecules including insulin- like growth factor-1 (IGF-1). The invention further provides a photocrosslinkable bioink composition comprising methacrylated derivatives of the polymers, PEGDA, and a photoinitiator, and a method of fabrication using three-dimensional bioprinting and photocrosslinking. The hydrogel patch exhibits strong adhesion to wet tissues, enhanced mechanical stability, and controlled degradation, and is useful for achieving rapid hemostasis and promoting tissue regeneration, including in liver bleeding and chronic wounds.
Disclaimer: Curated by HT Syndication.
