MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647077086 A) filed by Qualcomm Incorporated on June 22, 2026, for 3d Reconstruction Using 3d Triplane Representation.
Inventors include Zhu, Yinhao; Yasarla, Rajeev; Wang, Haiyan; Han, Shizhong Steve Number; Shi, Yunxiao; Cai, Hong; and Porikli, Fatih Murat.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: An apparatus for generation of a 3D representation of a scene includes a memory for storing a plurality of images depicting a scene; and processing circuitry in communication with the memory. The processing circuitry is configured to generate a depth map for the plurality of input images depicting a scene and unproject the depth map to a three-dimensional (3D) point cloud. The processing circuitry is also configured to project a plurality of 3D points from the 3D point cloud to a plurality of two dimensional (2D) planes and extract a plurality of triplane features from the plurality of 2D planes. The processing circuitry is further configured to generate a 3D representation of the scene based on combining the plurality of triplane features and a plurality of image features extracted from the plurality of input images.
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