Intellectual Property India Publishes Patent Application for 3d Printing Ink From Rice Stubble For Packaging Applications

MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202511056125 A) filed by Earthisol Private Limited on June 11, 2025, for 3d Printing Ink From Rice Stubble For Packaging Applications.

Inventors include Shivani Verma; Himanshu; and Asha Pasricha.

The application for the patent was published on July 31, 2026, under issue no. 31/2026.

Abstract: Disclosed biodegradable composite filament for 3D printing comprises rice stubble powder in an amount of 20 wt.% to 28 wt.%. Further, the biodegradable composite filament comprises a biodegradable thermoplastic polymer in an amount of 60 wt.% to 75wt.%. Further, the biodegradable composite filament comprises a biodegradable plasticizer in an amount of 2 wt.% to 6 wt.%. Further, the biodegradable composite filament comprises a compatibilizer in an amount of 1 wt.% to 5 wt.%. Further, the rice stubble powder is dispersed in the biodegradable thermoplastic polymer. Further, the biodegradable plasticizer reduces brittleness of the biodegradable composite filament. Further, the compatibilizer improves interfacial bonding between the rice stubble powder and the biodegradable thermoplastic polymer.

Disclaimer: Curated by HT Syndication.