MUMBAI, India, April 20 -- Intellectual Property India has published a patent application (202514040942 A) filed by E-Lead Electronic Co. Ltd., Changhua, Taiwan, on April 28, 2025, for 'wireless charging device with heat dissipation structure.'
Inventor(s) include Stephen, Hsi-Hsun, Chen.
The application for the patent was published on April 17, under issue no. 16/2026.
According to the abstract released by the Intellectual Property India: "A wireless charging device with a heat dissipation structure comprises a first housing and a second housing that are mutually combined. The first housing includes at least one charging pad, at least one intake grille, and at least one exhaust assembly. The at least one charging pad protrudes from an outer surface of the first housing and incorporates a heat sink for dissipating thermal energy generated during operation. A fan is positioned between the first housing and the second housing and generates an airflow into the interior of the housing. The airflow is then directed through an airflow channel toward the exhaust assembly of the first housing and an air discharge zone of the second housing. This configuration enables simultaneous cooling of the heat sink and a mobile device, achieving efficient heat dissipation."
Disclaimer: Curated by HT Syndication.
