MUMBAI, India, July 5 -- Intellectual Property India has published a patent application (202517059228 A) filed by Samsung Electronics Co. Ltd., Gyeonggi, Republic of Korea, on June 20, for 'wearable electronic device comprising substrate assembly.'
Inventor(s) include Lee, Wooram; and Park, Seho.
The application for the patent was published on July 4, under issue no. 27/2025.
According to the abstract released by the Intellectual Property India: "A wearable electronic device according to an embodiment of the present disclosure may comprise a housing, a substrate assembly disposed in the housing, and/or a coil assembly disposed around the substrate assembly. The substrate assembly may comprise a first substrate layer and/or at least one sensor including a plurality of electrical components (for example, photoelectric conversion devices). The first substrate layer may comprise a first conductive region having at least one conductive pattern formed therein and a first non-conductive region formed around the first conductive region. The plurality of electrical components may be arranged along the outer contour of the first substrate layer. The first conductive region may include outer edge portions disposed at the circumferences of the respective electrical components. The first non-conductive region may include at least one slit area disposed in the outer edge portions."
The patent application was internationally filed on Dec. 05, 2023, under International application No.PCT/KR2023/019908.
Disclaimer: Curated by HT Syndication.
