MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202517081154 A) filed by Avient Corporation, Avon Lake, U.S.A., on Aug. 27, for 'wafer carrier with moisture scavenging.'
Inventor(s) include Purayath, Vinod; Messmore, Benjamin; Scaglione, Heather; Silva, Italo; Suter, Ii, John D.; and Ohama, Kenta.
The application for the patent was published on Sept. 12, under issue no. 37/2025.
According to the abstract released by the Intellectual Property India: "A wafer carrier includes a housing having an interior space and a moisture scavenging compound in fluid communication with the interior space. The carrier provides a microenvironment with moisture control for semiconductor wafers enclosed within the carrier as they move through fabrication process steps."
The patent application was internationally filed on Feb. 27, 2024, under International application No.PCT/US2024/017465.
Disclaimer: Curated by HT Syndication.
