Intellectual Property India Publishes Patent Application for 'Wafer Boat Assembly And Semiconductor Process Device' Filed by Beijing Naura Microelectronics Equipment Co. Ltd.

MUMBAI, India, Oct. 11 -- Intellectual Property India has published a patent application (202517090981 A) filed by Beijing Naura Microelectronics Equipment Co. Ltd., Beijing, on Sept. 23, for 'wafer boat assembly and semiconductor process device.'

Inventor(s) include Zhou, Zhenxi; Yan, Zhishun; Hou, Pengfei; Zhao, Fuping; and Yang, Laibao.

The application for the patent was published on Oct. 10, under issue no. 41/2025.

According to the abstract released by the Intellectual Property India: "Provided in the present disclosure are a wafer boat assembly and a semiconductor process device. The wafer boat assembly comprises a plurality of wafer boats, which are configured to sequentially electrically connect to each other in a process chamber and in an axis direction of the process chamber, wherein at least one pair of adjacent wafer boats each have, at the bottoms of the sides opposite each other thereof, a front electrically conductive boat leg and a rear electrically conductive boat leg, a contact protrusion is provided at the top of one of the front electrically conductive boat leg and the rear electrically conductive boat leg, a contact recess is provided at the bottom of the other one of the front electrically conductive boat leg and the rear electrically conductive boat leg, and the contact recess is in contact with the contact protrusion, such that the adjacent wafer boats are electrically connected to each other; and the wafer boat among the plurality of wafer boats which is adjacent to an opening on a side of the process chamber is configured to be electrically connected to a power supply assembly, so as to receive a radio-frequency signal provided by the power supply assembly. In the present disclosure, adjacent wafer boats are electrically connected to each other by means of a rear electrically conductive boat leg and a front conductive boat leg forming a lap joint, such that not only can a radio-frequency signal be introduced from a single side and be transmitted between wafer boats, but a semiconductor process effect and a machine production capacity can also be ensured."

The patent application was internationally filed on Mar. 18, 2024, under International application No.PCT/CN2024/082111.

Disclaimer: Curated by HT Syndication.