MUMBAI, India, May 1 -- Intellectual Property India has published a patent application (202611023686 A) filed by Indian Institute Of Technology, New Delhi, on Feb. 27, for 'viscoelastic adhesive and method of fabrication thereof.'
Inventor(s) include Verma, Mohan Kumar Singh; Ghosh, Somnath; and Mukhopadhyay, Titir.
The application for the patent was published on May 1, under issue no. 18/2026.
According to the abstract released by the Intellectual Property India: "A viscoelastic adhesive and method of fabrication thereof is provided. The adhesive includes an adhesive layer having a viscoelastic polymer cross-linked using a cross-linking agent. The adhesive layer involve one of a single layer, a multi-layer and a gradient layer. The adhesive is suitable for medical bandages, wound dressings, wearable electronics, removable tapes, consumer adhesives, industrial fixtures, and temporary bonding applications requiring tunable adhesion and controlled detachment. The method involves tuning adhesion characteristics by controlling viscoelastic properties and geometric parameters. The method is cost-effective and scalable. The disclosure enables systematic control of adhesion by adjusting cross-linking agent's concentration and adhesive thickness, allowing optimization of adhesion strength for specific applications without altering the base polymer chemistry."
Disclaimer: Curated by HT Syndication.
