MUMBAI, India, April 20 -- Intellectual Property India has published a patent application (202544097757 A) filed by Te Connectivity Solutions Gmbh, Schaffhausen, Switzerland, on Oct. 10, 2025, for 'vehicular antenna having a low-profile antenna assembly for non-metal surface and metal surface application.'

Inventor(s) include Ng, Kokjiunn; Tan, Poi Ngee; Lee, Tinghee; and Lim, Keanmeng.

The application for the patent was published on April 17, under issue no. 16/2026.

According to the abstract released by the Intellectual Property India: "A vehicular antenna includes a low-profile housing (110) having a first end and a second end and having a first side and a second side. An antenna assembly (200) is provided in the low-profile housing. The antenna assembly includes a first cellular antenna (300) at the first end (212) and a second cellular antenna (400) at the second end (214). The antenna assembly includes a first ground element (240) at the first side (216) and a second ground element (260) at the second side (218). The first cellular antenna is operably coupled to the first ground element and the second cellular antenna is operably coupled to the second ground element. The first ground element is isolated from the second ground element."

Disclaimer: Curated by HT Syndication.