MUMBAI, India, July 5 -- Intellectual Property India has published a patent application (202517055609 A) filed by Kuraray Co. Ltd., Okayama, Japan, on June 9, for 'vapor deposition film, multilayer structure, packaging material, vacuum packaging bag and vacuum thermal insulation body.'
Inventor(s) include Nonaka Yasuhiro; Ishihara Hisashi; and Kataoka Naoki.
The application for the patent was published on July 4, under issue no. 27/2025.
According to the abstract released by the Intellectual Property India: "The present invention provides: a vapor deposition film which is suppressed in decrease of gas barrier properties after bending and after storage; and a multilayer structure, a packaging material, a vacuum packaging bag and a vacuum thermal insulation body, each one of which uses this vapor deposition film. This vapor deposition film comprises a resin barrier layer (A) and an aluminum vapor deposition layer (B) which is directly superposed on the barrier layer (A) and has an average thickness of 30 nm to 100 nm; the aluminum vapor deposition layer (B) comprises an aluminum oxide layer (B1) and an aluminum layer (B2) sequentially from the side of a surface that is in contact with the barrier layer (A)."
The patent application was internationally filed on Nov. 16, 2023, under International application No.PCT/JP2023/041255.
Disclaimer: Curated by HT Syndication.
