MUMBAI, India, April 20 -- Intellectual Property India has published a patent application (202647042459 A) filed by Resonac Corporation, Tokyo, on April 2, for 'two-dimensional model generation method, two-dimensional model generation device, and program.'
Inventor(s) include Sekine, Chisa; Nishino, Takayuki; Okuno, Yoshishige; Hasegawa, Takahiko; Kawanami, Kenichi; and Kondo, Kunio.
The application for the patent was published on April 17, under issue no. 16/2026.
According to the abstract released by the Intellectual Property India: "Provided is a two-dimensional model generation method for generating a two-dimensional model of a connection structure that uses tapered threads. The two-dimensional model generation method, which generates a two-dimensional model of a connection structure in which a first column body having a first tapered female thread portion and a second column body having a second tapered female thread portion are connected by a joint body having a body portion, a first tapered male thread portion, and a second tapered male thread portion, causes a computer to perform: a step for receiving input of parameters; a step for drawing a vertically symmetrical body portion, a first tapered male thread portion and a second tapered male thread portion that are vertically symmetrical, and a first tapered female thread portion and a second tapered female thread portion that are vertically symmetrical, on the basis of the input parameters; a step for moving the first tapered male thread portion, the first tapered female thread portion, and the second tapered female thread portion in the horizontal direction radially outward, on the basis of the input parameters; a step for moving the body portion of a joint body in the vertical direction on the basis of the input parameters; a step for moving the second tapered male thread portion in the horizontal direction radially inward on the basis of the input parameters; and a step for moving the second tapered female thread portion along the taper on the basis of the input parameters."
The patent application was internationally filed on Sept. 19, 2024, under International application No.PCT/JP2024/033477.
Disclaimer: Curated by HT Syndication.
