MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202617016107 A) filed by Bostik Sa, Puteaux, France, on Feb. 13, for 'two-component thermally conductive composition.'
Inventor(s) include Sanz, Federico; Holle, Sophie; Olejnik, Nicolas; Mayer, Christoph; and Stosser, Benjamin.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "The invention relates to a two-component thermally conductive composition comprising: - a component A comprising: * at least one polyol P having a functionality of at least 4, and * at least one thermally conductive filler; and - a component B comprising: * at least one polyisocyanate, and * at least one thermally conductive filler; wherein the at least one thermally conductive filler in each of components A and B is selected from metal silicates, metal oxides, metal hydroxides, metal and metalloid nitrides, metal and metalloid carbides, metallic fillers, graphites, and mixtures thereof The invention also relates to the use of the composition according to the invention. Furthermore, the invention relates to a method for bonding substrates implementing the composition according to the invention. Finally, the invention relates to an article comprising the composition according to the invention."
The patent application was internationally filed on Aug. 28, 2024, under International application No.PCT/EP2024/073996.
Disclaimer: Curated by HT Syndication.
