MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517049425 A) filed by Dai Nippon Printing Co. Ltd., Tokyo, on May 22, for 'through-hole electrode substrate and method for manufacturing through-hole electrode substrate.'
Inventor(s) include Suzuki Miyuki; Morii Akio; Yoshii Yumi; Arai Junko; Tsunoda Tsuyoshi; and Fujimoto Koji.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "This through-hole electrode substrate comprises: a substrate including a first surface and a second surface positioned on the opposite side from the first surface and having a through-hole penetrating from the first surface to the second surface; a metal layer including at least a hole metal layer positioned at the through-hole; and an adhesion layer positioned between the substrate and the metal layer and including a metal oxide. The through-hole has a side wall reaching from the first surface to the second surface. The side wall includes a first end connected to the first surface and a second end connected to the second surface. The adhesion layer includes a hole adhesion layer that is positioned between the side wall and a through-hole electrode so as to extend from the first end of the side wall to the second end thereof."
The patent application was internationally filed on Nov. 02, 2023, under International application No.PCT/JP2023/039769.
Disclaimer: Curated by HT Syndication.
