MUMBAI, India, May 30 -- Intellectual Property India has published a patent application (202517038632 A) filed by Lg Chem, Ltd., Seoul, Republic of Korea, on April 22, for 'thermoplastic resin composition, method for producing same, and molded article including same.'

Inventor(s) include An, Yong Hee; Kim, Seo Hwa; Cho, Yun Kyoung; Park, Chun Ho; Kim, Ho Hoon; Jang, Jeongmin; and Hwang, Hyeri.

The application for the patent was published on May 30, under issue no. 22/2025.

According to the abstract released by the Intellectual Property India: "The present invention relates to a thermoplastic resin composition, a method for producing same, and a molded article including same. More specifically, the present invention relates to: a thermoplastic resin composition having an alkyl acrylate coverage value (X) of at least 65 wt% as calculated by Equation 1 and containing (A) 46-81 wt% of an alkyl acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer including an alkyl acrylate rubber having an average particle size of 50-150 nm, (B) 100 parts by weight of a base resin including 19-54 wt% of an aromatic vinyl compound-vinyl cyanide compound copolymer containing at least 10 wt% and less than 26 wt% of a vinyl cyanide compound and having a weight average molecular weight of 65,000-110,000 g/mol, and (C) at least 3 parts by weight of a thermoplastic polyester elastomer; a method for producing same; and a molded article including same. The present invention has the effect of providing: a thermoplastic resin composition which has excellent mechanical properties, processability, and weather resistance, has a pleasing appearance due to having excellent low-whitening properties even in a thick sheet, and has excellent economic feasibility and eco-friendliness due to being applicable to unpainted sheets; a method for producing same; and a molded article including same."

The patent application was internationally filed on Aug. 30, 2024, under International application No.PCT/KR2024/013025.

Disclaimer: Curated by HT Syndication.