Intellectual Property India Publishes Patent Application for 'Thermoplastic Polyolefin Composition With Reactive Compatibilization' Filed by Dow Global Technologies, Llc

MUMBAI, India, June 20 -- Intellectual Property India has published a patent application (202517047068 A) filed by Dow Global Technologies, Llc, Midland, U.S.A., on May 15, for 'thermoplastic polyolefin composition with reactive compatibilization.'

Inventor(s) include Munro, Jeffrey C.; Neilson, Bethany M.; Kean, Zachary S.; and Waller, Peter J.

The application for the patent was published on June 20, under issue no. 25/2025.

According to the abstract released by the Intellectual Property India: "The present disclosure provides a composition. In an embodiment, the composition includes (A) a nonfunctionalized propylene-based polymer, (B) a functionalized propylene- based polymer, and (C) a functionalized ethylene-based polymer. The functionalized propylene-based polymer (B) and the functionalized ethylene-based polymer (C) each has a different functional group, the functional group selected from the group consisting of maleic anhydride and an epoxide."

The patent application was internationally filed on Dec. 04, 2023, under International application No.PCT/US2023/082325.

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