MUMBAI, India, June 27 -- Intellectual Property India has published a patent application (202527052686 A) filed by Mitsubishi Electric Corporation, Tokyo, on May 30, for 'thermal impedance monitoring process for power module.'
Inventor(s) include Pichon, Pierre-Yves; and Brandelero, Julio.
The application for the patent was published on June 27, under issue no. 26/2025.
According to the abstract released by the Intellectual Property India: "Thermal impedance monitoring process for a power module of a power converter used for transforming DC current to AC current, or vice-versa, where the semiconductor dissipates an asymmetrical loss between two half cycles of an AC frequency f of the AC current, said power module comprising at least a semiconductor die attached to a material stack-up of layers for its thermal dissipation and/or electrical connections, said process comprising: - sampling and measuring a signal relating to the junction temperature Tj of said semiconductor die at a frequency higher than twice said AC frequency of said AC current, - calculating a time duration ?t= tTjmax- tTjmin between a moment tTjmax, where said junction temperature of said semiconductor die is at a maximum value, and a moment tTjmin, where said junction temperature is at a minimum value, in one period of said AC current, and storing said time duration ?t in a memory, - repeating said sampling and measuring said signal and said calculating said time duration at different times tx=t0 to tm during the operating life of the power module to provide a series of time durations ?tt0 to ?ttm and comparing said time durations ?tt0 to ?ttm values for monitoring an evolution of said time duration At to determine an evolution of degradation of the thermal impedance of said power module."
The patent application was internationally filed on Aug. 07, 2023, under International application No.PCT/JP2023/029389.
Disclaimer: Curated by HT Syndication.
