Intellectual Property India Publishes Patent Application for 'The Composition And Thermal Curable Adhesive Film Derived Thereof' Filed by Henkel Ag & Co. Kgaa

MUMBAI, India, Nov. 14 -- Intellectual Property India has published a patent application (202547097457 A) filed by Henkel Ag & Co. Kgaa, Duesseldorf, Germany, on Oct. 9, for 'the composition and thermal curable adhesive film derived thereof.'

Inventor(s) include Luo, Yizhong; and Shen, Dongmei.

The application for the patent was published on Nov. 14, under issue no. 46/2025.

According to the abstract released by the Intellectual Property India: "A composition and a thermal curable adhesive film derived thereof. The thermal curable adhesive film can be activatable at low temperature (lower than 100?, preferably from 60? to 80?) and is capable of being self-supported and exhibiting excellent bonding strength when cured."

The patent application was internationally filed on Mar. 15, 2023, under International application No.PCT/CN2023/081533.

Disclaimer: Curated by HT Syndication.