MUMBAI, India, Aug. 22 -- Intellectual Property India has published a patent application (202517055732 A) filed by Qualcomm Incorporated, San Diego, on June 10, for 'techniques for load resistance signaling for wireless power transfer.'
Inventor(s) include Patchava, Raviteja; and Gupta, Piyush.
The application for the patent was published on Aug. 22, under issue no. 34/2025.
According to the abstract released by the Intellectual Property India: "Certain aspects of the present disclosure provide techniques for load resistance signaling for wireless power transfer. A method (800) for wireless communication by a first wireless communication device includes receiving (805), from a second wireless communication device, a first plurality radio frequency (RF) signals, performing (810) power measurements associated with the first plurality of RF signals, and transmitting (815), based in part on the power measurements, information indicating a waveform for the second wireless communication device to use to transmit a second plurality of RF signals to the first wireless communication device."
The patent application was internationally filed on Feb. 05, 2024, under International application No.PCT/US2024/014399.
Disclaimer: Curated by HT Syndication.
