MUMBAI, India, Dec. 13 -- Intellectual Property India has published a patent application (202511085351 A) filed by Transpacks Technologies Pvt. Ltd., Kanpur, Uttar Pradesh, on Sept. 9, for 'tamper-evident unclonable labelling and packaging accessory for integrity verification of articles and method thereof.'
Inventor(s) include Ashis Chakraborty; Gaurav Singh; Satish Chandra; and Deepak Gupta.
The application for the patent was published on Dec. 12, under issue no. 50/2025.
According to the abstract released by the Intellectual Property India: "The present invention discloses a tamper-evident unclonable labelling and packaging accessory for integrity verification of an article and a method thereof. The tamper-evident unclonable labelling and packaging accessory (100) comprises a base substrate (102), reinforcement fibres (104), and an adhesive layer (106). The base substrate (102) is configured to provide a printability surface for incorporating at least one of: user defined information and one or more tamper-evident elements. The reinforcement fibres (104) are configured to enhance at least one of: tensile strength and tear resistance. The adhesive layer (106) is configured to provide a secure attachment of the tamper-evident unclonable labelling and packaging accessory (100) to a target surface. The tamper-evident unclonable labelling and packaging accessory (100) provides significant advantages in security and versatility for packaging applications. The tamper-evident unclonable labelling and packaging accessory (100) provides enhanced protection against counterfeiting and tampering."
Disclaimer: Curated by HT Syndication.
