MUMBAI, India, Oct. 24 -- Intellectual Property India has published a patent application (202431031632 A) filed by Indian Institute Of Technology, Guwahati, Assam, on April 22, 2024, for 'systems for fabricating and repairing objects by waam processes through sequentially-controlled droplet transfer strategy.'
Inventor(s) include Chandra Prakash Singh; Ritam Sarma; V. Sathesh Raja; Umesh Melkani; and Sajan Kapil.
The application for the patent was published on Oct. 24, under issue no. 43/2025.
According to the abstract released by the Intellectual Property India: "A method for fabricating precise metallic components by depositing drop (300) on demand is disclosed herein. The method starts with generating sufficient heat (500) through GMAW, GTAW and PAW process to deposit metal droplet (300) into the substrate/prebuilt layer. The deposited drop (300) can be shielded for appropriate time by supplying the adequate volume of shielding gas (200) post deposition. This feature of the disclosed method helps in depositing highly corrosive materials such as Ti6AlV4 in an open environment. An optimized stepover between two drops leads to formation of a near flat beads. The order and inter drop cooling time help in obtaining desired thermal gradient in the deposited bead yielding tailored microstructural phases. The disclosed method has the capability of performing in situ heat treatment through the plasma arc (510). The transfer of engineered droplets helps in fabricating precise small metallic components through WAAM. The disclosed method can also be utilized in repairing damaged metallic components such as holes without use of other manufacturing process. Moreover, the current invention can be implemented in fabricating overhang features without support structures."
Disclaimer: Curated by HT Syndication.
