Intellectual Property India Publishes Patent Application for 'Systems And Methods For Rotor Assemblies And Rotor Cooling Arrangments' Filed by Tau Motors, Inc.

MUMBAI, India, April 10 -- Intellectual Property India has published a patent application (202647041472 A) filed by Tau Motors, Inc., Redwood City, U.S.A., on March 31, for 'systems and methods for rotor assemblies and rotor cooling arrangments.'

Inventor(s) include Pennington III, Walter Wesley; Stevenson, Gregory Gordon; Swint, Ethan Bagget; Owen, Michael Parker; and Preindl, Matthias.

The application for the patent was published on April 10, under issue no. 15/2026.

According to the abstract released by the Intellectual Property India: "A rotor chipset assembly and an electric motor including the assembly are provided. The assembly comprises a printed circuit board having opposing first and second surfaces, the printed circuit board including a plurality of electronic components each having an outward surface, wherein the first, second, and outward surfaces define a board surface profile; a cooling jacket coupled to the printed circuit board, the cooling jacket including an inner surface that faces the board surface profile, wherein the cooling jacket includes a fluid inlet port proximate a first end of the printed circuit board, and wherein the cooling jacket includes a first jacket portion that faces the first surface of the printed circuit board and a second jacket portion that faces the second surface of the printed circuit board; and a coolant fluid pathway volume defined by the board surface profile and the inner surface of the cooling jacket."

The patent application was internationally filed on Sept. 03, 2024, under International application No.PCT/US2024/045032.

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