MUMBAI, India, Jan. 9 -- Intellectual Property India has published a patent application (202511117688 A) filed by Delhi Technical Campus, Greater Noida, Uttar Pradesh, on Nov. 26, 2025, for 'system for facilitating job and internship matching.'
Inventor(s) include Neha Sehgal; Sudha; Hilal Ahmad; Nimesh Chauhan; and Hargun Dogra.
The application for the patent was published on Jan. 9, under issue no. 02/2026.
According to the abstract released by the Intellectual Property India: "A system for facilitating job and internship matching, comprising a user interface 101 presenting job opportunities as swipeable cards, a matching engine 102 generating personalized job recommendations based on user skills and preferences using machine learning, a swipe input module 103 detecting directional swipes to apply or dismiss jobs, an integrated application management module 104 tracking applications with real-time status updates, and an interview preparation module 105 offering automated resume feedback and AI-powered interview simulations, further comprising a recruiter interface presenting candidate profiles in swipeable cards enabling recruiters to express interest, where mutual interest initiates in-app chat, and a job posting module allowing recruiters to create, promote, and analyze job listings with analytics tools measuring candidate engagement, swipe frequency, and application conversions, all designed to streamline the job application process and enhance user engagement."
Disclaimer: Curated by HT Syndication.
