MUMBAI, India, Jan. 2 -- Intellectual Property India has published a patent application (202541122459 A) filed by Shreeshayana R; Atme College Of Engineering, Mysuru; and Dr. Sathish K R, Mysuru, Karnataka, on Dec. 5, 2025, for 'system and method for 3d printing using recycled polymer filament.'
Inventor(s) include Shreeshayana R; Dr. Sathish K R; Dr. Parthasarathy L; Dr. Raghavendra L; Kavyashree S; Swathi C A; Maria Sushma S; Swapna H; Dr. Praveen Kumar M; and Dr. Shakunthala C.
The application for the patent was published on Jan. 2, under issue no. 01/2026.
According to the abstract released by the Intellectual Property India: "The invention relates to a system and method for producing high-quality recycled filament for use in fused deposition modelling (FDM) 3D printing applications. The system integrates a shredding mechanism for converting failed prints and polymer waste into uniform flakes, a controlled drying and filtration module for removing moisture and impurities, and a precision extrusion unit capable of maintaining consistent melt flow and filament diameter. A real-time optical or laser-based monitoring mechanism adjusts extrusion speed to maintain filament tolerance within acceptable limits. The invention further includes a microcontroller-based control architecture that regulates extrusion temperature, material flow, and system safety parameters while enabling compatibility with standard FDM printers. The recycled filament produced using this method provides reliable printability, reduced environmental impact, and significantly lower production cost compared to commercially available virgin filaments. The system enhances sustainability in additive manufacturing by enabling closed-loop material recycling and reducing plastic waste generated from prototyping, support structures, and failed prints. The invention is applicable in educational institutions, research laboratories, small-scale industries, and environmentally conscious manufacturing environments seeking cost-effective and sustainable 3D printing solutions."
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