Intellectual Property India Publishes Patent Application for 'Structure Of Needle Board For Needle Punching Machines, Method For Its Production, And Needle Punching Machine Comprising Such A Needle Board' Filed by Ttnb Italia S. R. L.

MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202617000376 A) filed by Ttnb Italia S. R. L., Quarrata, Italy, on Jan. 2, for 'structure of needle board for needle punching machines, method for its production, and needle punching machine comprising such a needle board.'

Inventor(s) include Nencini, Gabriele.

The application for the patent was published on March 13, under issue no. 11/2026.

According to the abstract released by the Intellectual Property India: "A needle board structure (10) for needle-punching machines (100), having a flat shape with a predetermined thickness (11) and comprising a plurality of holes (20) each designated to receive the body (31) of a needle-punching needle (30). The needle board (10) further comprises: a first face (40) configured to receive angled butts (32) of the needles (30); a second face (50) opposite the first face (40). The first face (40) is defined by a first rigid layer (41), and the second face (50) is defined by a second rigid layer (51). The holes (20) pass through the first and second rigid layers (41,51) with a nominal diameter (24) equal to the diameter (34) of the body (31) of the needles (30) that the holes (20) are configured to accommodate. Between the first and second rigid layers (41,51) is a compression-rigid intermediate layer (60) spanned by the holes (20), the compression-rigid intermediate layer (60) comprises a compression-rigid expanded material (61) with densities between 30 kg/m3 and 900 kg/m3, preferably between 35 and 600 kg/m3, and even more preferably between 40 and 300 kg/m3. The expanded material (61) has a compressive modulus in the elastic range greater than 30 MPa and a compressive strength greater than 400 kPa. The invention also includes a needle-punching machine (100) using such a needle board (10), and a method of manufacturing such a needle board (10)."

The patent application was internationally filed on July 18, 2024, under International application No.PCT/IB2024/056997.

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