MUMBAI, India, Nov. 14 -- Intellectual Property India has published a patent application (202547096976 A) filed by Te Connectivity Solutions Gmbh, Schaffhausen, Switzerland, on Oct. 8, for 'stripline wafer for wafer based connector system.'
Inventor(s) include Walton, Scott Eric; Miller, Keith Edwin; Champion, Bruce Allen; Cina, Michael Frank; Rosenau, Joshua Allen; and Gingrich III, Charles Raymond.
The application for the patent was published on Nov. 14, under issue no. 46/2025.
According to the abstract released by the Intellectual Property India: "A multilayer stripline wafer for use in an electrical connector. The multilayer stripline wafer includes multiple layers. Signal transmission pathways are positioned on at least one internal layer of the multiple layers. The signal transmission pathways may be uncoupled or loosely coupled singe ended single ended signal transmission pathways or differentially coupled signal transmission pathways. Conductive planar members are positioned in one or more layers of the multiple layers. The conductive planar members are spaced from the signal transmission pathways. One or more conductive planar members controls the impedance of the signal transmission pathways."
The patent application was internationally filed on Mar. 14, 2024, under International application No.PCT/IB2024/052490.
Disclaimer: Curated by HT Syndication.
