MUMBAI, India, Oct. 11 -- Intellectual Property India has published a patent application (202517078963 A) filed by Prime Polymer Co. Ltd., Tokyo, on Aug. 20, for 'stretched film,laminate, packaging material and method for producing stretched film.'
Inventor(s) include Sekiya Keiko; and Yoshidome Ken.
The application for the patent was published on Oct. 10, under issue no. 41/2025.
According to the abstract released by the Intellectual Property India: "[Problem] The present invention addresses the problem of providing a film which has an excellent balance among rigidity, low shrinkage and longitudinal tear strength, and which can be used as a base material of a packaging material that has excellent gloss. [Solution] The present invention provides a stretched film which contains: an ethylene polymer wherein (a1) the melt flow rate (MFR) as measured at 190 C under a load of 2.16 kg is 0.2 g/10 minutes to 10 g/10 minutes, and (a2) the density is 940 to 970 kg/m3; and 100 ppm to 2,500 ppm of a nucleator relative to 100 parts by mass of the ethylene polymer. The present invention also provides: a packaging material which is composed of this stretched film; and a method for producing this stretched film."
The patent application was internationally filed on Mar. 29, 2024, under International application No.PCT/JP2024/013033.
Disclaimer: Curated by HT Syndication.
