MUMBAI, India, May 30 -- Intellectual Property India has published a patent application (202311079875 A) filed by Chandigarh Group Of Colleges, Mohali, Punjab, on Nov. 24, 2023, for 'soil surface digging assistive device for handicapped.'
Inventor(s) include Diksha Thakur; and Vikas Bisnoi.
The application for the patent was published on May 30, under issue no. 22/2025.
According to the abstract released by the Intellectual Property India: "A soil surface digging assistive device for handicapped comprises of a cylindrical hollow body 1 developed to be accommodated over arm of a handicapped user, a plate 2 is configured with the body 1 through a rod 3 for digging a soil surface as per requirement of the user, a camera 4 mounted on the body 1 for capturing multiple images of the user's arm, an artificial intelligence protocol encrypted with the microcontroller for detecting dimensions of the user's arm, an air compressor 6 paired with the member 5 for inflating the member 5 in view of gripping the user's arm within the body 1 in a secured manner, a tactile sensor mapped on the member 5 for detecting hardness of the soil surface and a pressure sensor configured on the member 5 for detecting pressure applied by the member 5 on the soil surface."
Disclaimer: Curated by HT Syndication.
