MUMBAI, India, Oct. 31 -- Intellectual Property India has published a patent application (202411023990 A) filed by Chandigarh University; and Chandigarh University Technology Business Incubator, Mohali, Punjab, on March 26, 2024, for 'soil drilling and pipe placement device.'
Inventor(s) include Parveen.
The application for the patent was published on Oct. 31, under issue no. 44/2025.
According to the abstract released by the Intellectual Property India: "A soil drilling and pipe placement device, comprising a circular shaped frame 1 positioned on a mouth portion of a pipe, an artificial intelligence based image capturing module 2 determines diameter of pipe, an expandable pulley arrangement expand frame 1 to get secured on mouth portion securely, as detected by plurality of touch sensors, plurality of suction units 3 installed on inner periphery of frame 1 for gripping mouth portion firmly, a computing unit accessed by user to enter details regarding depth or distance user desired to dig, plurality of conical shaped motorized drilling unit 4 digs soil, an ultrasonic sensor monitors depth dug by drilling unit, and plurality of caterpillar wheels 5 installed beneath frame 1 for moving frame 1 along with pipe while drilling units 4 perform digging of soil."
Disclaimer: Curated by HT Syndication.
